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Cutting-edge engineering!
Over 20 years at the forefront, working with the most advanced Design & Simulation tools, delivering Thermal / CFD Consulting & innovative Solutions for electronic components, systems, datacenters & mission critical facilities.
Our unique Fluid-to-Air Heat-Exchangers & Burn-In Chambers have revolutionized the industry!
Our solutions seamlessly integrate with the world’s leading companies!
Enables air-cooled facilities, with no water infrastructure, to support water-cooled electronics / systems / critical equipment
• Full redundancy of the cooling & power systems
• Hot Swappable
• High Cooling Capacity per system footprint ratio.
• Cooling Solutions of 55kW, 110kW
• Supports Microsoft’s and Nvidia’s standards & regulations
• Installed at datacenters worldwide, Nvidia, OpenAI…
• Outstanding Outcomes!
This thermal compound promptly decreases temperatures, resulting in reduced equipment noise & enhanced user comfort.
• Following extensive testing, exhibits an exceptionally high thermal conductivity & outstanding stability even after extended usage, or most demanding configurations!
• An optimal choice for highly experienced PC builders due to its extreme heat dissipation & electrical conduction facilitation!
• An extremely practical syringe, makes it easy to apply exactly on the CPU Cooler, the GPU Cooling / heat dissipation rib plates, the heat-sink…
• Liquid Metal thermal solution is compatible with: Computer parts, laptops, MacBooks, Consoles (PS3, 4, 5, Xbox 360, One, Series S and X). High-Performance Computing (HPC) applications.
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