TopC

When Data Center operators contemplate assimilating water-cooled systems/electronics, (such as HPC/Nvidia), into an air-cooled facility, the dichotomy emerges: either eschew this prospect and lag in technological advancement or embark on a facility metamorphosis, necessitating a  multimillion-$ investment in water infrastructure.

Enter our cutting-edge solution: a state-of-the-art Fluid-to-Air Heat Exchanger that not only optimizes cost-effectiveness but also expedites deployment, positioning you at the vanguard of technological efficiency!

TopC enables air-cooled facilities to support water-cooled electronics!